To meet a variety of customer identified challenges, UltraSource has developed a new filled via product, the UltraVia™. This patented technology uses pure metal filled via materials that are bonded directly into the ceramic vias to provide a robust, highly conductive, highly reliable connection in thin film substrates. The UltraVia improves on existing filled via technologies by virtually eliminating epoxy or solder bleed-through while enhancing via conductivity and reliability.

 

For Design Guidelines See Plated-Thru Holes and Filled Vias

 

compare-ultraviaCross Section of a pure gold UltraVia™