In direct response to customer requests for lower cost and higer performance, UltraSource has developed a new filled via product, the CopperVia™ .This new tchnology, based on the patented UltraVia process, fills the vias with pure copper material in order to provide a low cost, highly conductive, extremely reliable electrical and thermal path on ceramic substrates. Like it's sister technology, UltraVia™ , the CopperVia™  virtually eliminates epoxy or solder bleed-through while maximizing thermal and eletrical conductivity and reliability. 

 

For Design Guidelines See Plated-Thru Holes and Filled Vias

via crosssection sm

Cross Section of a pure copper CopperVia™