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UltraTechnologies

When you choose UltraSource as your thin film manufacturing partner you get more than a world-class design, manufacturing and processing facility at your service, you get to take advantage of the latest innovations in thin film today. Innovations and technology that will not only help you solve critical size/performance issues, but will also allow you the freedom to integrate the latest and most advanced multilayer thin film techniques and functions into your RF and microwave circuit and component designs.

The UltraBridge™ technique also reduces the number of mask steps by 30% over air-bridge techniques, resulting in reduced design complexity and increased reliability. The hardness of the silicon nitride creates a very robust interconnect design unaffected by accidental compression during inspection or assembly.