As fired 96% Alumina
CLA Surface Roughness (µ-inches) = 35
Thickness Available (inches) .010-.120
Dissipation Factor at 1 MHz 0.0004
Dielectric Constant (k) 9.5
Thermal Conductivity (W/mK) 26
Coefficient of Thermal Exp. (ppm/°C) 6.3-8.0 (25-1000°C)
Applications Low to medium power DC & RF circuits
As fired 99.6% Alumina
CLA Surface Roughness (µ-inches) 4
Thickness Available (inches) .005-.040
Dissipation Factor at 1 MHz 0.0001
Dielectric Constant (k) 9.9
Thermal Conductivity (W/mK) 30
Coefficient of Thermal Exp. (ppm/°C) 7.0-8.3 (25-1000°C)
Applications Low to medium power DC & RF circuits
Polished 99.6% Alumina
CLA Surface Roughness (µ-inches) 2
Thickness Available (inches) .004-.040
Dissipation Factor at 1 MHz 0.0001
Dielectric Constant (k) 9.9
Thermal Conductivity (W/mK) 30
Coefficient of Thermal Exp. (ppm/°C) 7.0-8.3 (25-1000°C)
Applications Low to medium power RF and Microwave circuits
Lapped Aluminum Nitride
CLA Surface Roughness (µ-inches) 25
Thickness Available (inches) .004-.120
Dissipation Factor at 1 MHz 0.001
Dielectric Constant (k) 8.6
Thermal Conductivity (W/mK) 170 min
Coefficient of Thermal Exp. (ppm/°C) 4.6 at (25-300°C)
Applications High power DC/RF/microwave circuits
Polished Aluminum Nitride
CLA Surface Roughness (µ-inches) 3
Thickness Available (inches) .004-.080
Dissipation Factor at 1 MHz 0.0005
Dielectric Constant (k) 8.6
Thermal Conductivity (W/mK) 170 min
Coefficient of Thermal Exp. (ppm/°C) 4.6 (25-300°C)
Applications High power DC/RF/microwave circuits
Polished 99.5% Beryllium-Oxide
CLA Surface Roughness (µ-inches) 3
Thickness Available (inches) .007-.080
Dissipation Factor at 1 MHz 0.0004
Dielectric Constant (k) 6.5
Thermal Conductivity (W/mK) 250 min
Coefficient of Thermal Exp. (ppm/°C) 6.4-8.6 (25-1000°C)
Applications High power DC/RF/microwave circuits
Ferrite/Garnet
CLA Surface Roughness (µ-inches) 4 - 40
Thickness Available (inches) .010 and up
Dissipation Factor at 1 MHz .00015 - .0025
Dielectric Constant (k) 9.0 - 15.5
Thermal Conductivity (W/mK) .7 - 4.5
Coefficient of Thermal Exp. (ppm/°C) 2.4 - 10.8
Applications Microwave, circulators, isolators, components
Borosilicate Glass
CLA Surface Roughness (µ-inches) 3.9x10-8
Thickness Available (inches) 0.7mm - 25.4mm
Dissipation Factor at 1 MHz .00037
Dielectric Constant (k) 4
Thermal Conductivity (W/mK) 1.2
Coefficient of Thermal Exp. (ppm/°C) 3.25 (through 300°C)
Applications Optical windows, biomedical
Sapphire
CLA Surface Roughness (µ-inches) .1
Thickness Available (inches) .003-.250
Dissipation Factor at 1 MHz 0.00086/0.0003
Dielectric Constant (k) 9.3-11.4
Thermal Conductivity (W/mK) 40
Coefficient of Thermal Exp. (ppm/°C) A plane at 25°C 5.3
Applications Optical
Polished Fused Silica/Z-Cut Quartz
CLA Surface Roughness (µ-inches) .1
Thickness Available (inches) .003-.040
Dissipation Factor at 1 MHz 0.000015
Dielectric Constant (k) 3.8
Thermal Conductivity (W/mK) 1.4
Coefficient of Thermal Exp. (ppm/°C) 0.56
Applications High frequency circuits requiring extremely low loss performance
Silicon
CLA Surface Roughness (µ-inches) 7.8 x 10-7
Thickness Available (inches) .25mm - .5mm
Dissipation Factor at 1 MHz .005
Dielectric Constant (k) 11.8
Thermal Conductivity (W/mK) 125
Coefficient of Thermal Exp. (ppm/°C) 2.5
Applications Optical, medical, IR, sensors, components
Polished Titanates
CLA Surface Roughness (µ-inches) 3
Thickness Available (inches) .005-.080
Dissipation Factor at 1 MHz 0.0004
Dielectric Constant (k) 38-200
Thermal Conductivity (W/mK) 1.8-4.2
Coefficient of Thermal Exp. (ppm/°C) 5.8
Applications RF & microwave circuits requiring high Q
* indicates required