HOLLIS, NH, June 18, 2014: UltraSource, Inc. (USI) announced today that it has developed a reduced cost plugged via option called PolyVia. PolyVia was recently showcased at the IEEE-IMS, Tampa Bay, on June 3-5. The PolyVia product is a polyimide-based plugged via option that customers can add to their plated-through hole designs in order to stop epoxy or solder bleed-thru during assembly operations.

Michael Casper, President & CEO of UltraSource, said “our customers are always looking for new ways to reduce costs and increase performance, especially for their lower cost commercial products. We spent the last six months developing a low cost but highly reliable polyimide plugged via. We are confident that the PolyVia will allow our customers to be more competitive by eliminating rework at assembly operations – avoiding the need for a more costly metal filled via system.”

UltraSource is excited to offer the new technology PolyVia system which eliminates epoxy or solder bleed-through but at a much lower cost than pure metal filled via products like UltraVia, CopperVia, or Hi-Rel CopperVia that UltraSource offers.

Performance Benefits of PolyVia:

  • Eliminates mess and rework associated with epoxy or solder “bleed-through” that can occur during die & housing assembly from plated-through holes or slots

  • Excellent adhesion to thin film gold and other metals

  • Superior thermal resistance, unaffected by typical assembly temperatures (up to 320°C)

  • Excellent resistance to many solvents

  • Low Cost

The new PolyVia will provide a flexible, reliable technology that enables the realization of low cost, high performance DC/RF/microwave, and optical structures. The PolyVia is a new technology that has been added to the UltraSource Technology Platform, which provides customers with the most comprehensive suite of thin film solutions available anywhere.

To discuss your specific design and application needs, contact UltraSource at www.UltraSource.com or (800) 742-9410.

About UltraSource
Founded in 1991, UltraSource, Inc. (USI) is one of the world’s largest thin film suppliers offering leading edge quick turn, custom, and volume production services of complex microcircuits for technically demanding high density analog, mixed-signal, digital, power, hybrid circuit, RF, microwave and millimeter wave applications. Electronics system design is placing increasing emphasis on high frequency performance and reduced package size; UltraSource products and services deliver thin film microcircuit solutions that enable customers to advance towards evolutionary bandwidth performance, integration, and quality. UltraSource solutions include: volume thin film products, advanced high density thin film multilayer interconnects and circuits customized for aerospace/defense, homeland security, electronic medical devices applications, I/R imaging, sensor, hermetic seal metallization, resistive heaters for optical lenses, telecommunications infrastructure, fiber optics, broadband networking, test and measurement, and many other specialty electronic applications. UltraSource, Inc. is headquartered in Hollis, NH, USA. Additional information is available at www.ultrasource.com.


Corporate Communications Manager
Dawn Hallett
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