FOR IMMEDIATE RELEASE

March 13, 2014

HOLLIS, NH, MARCH 13, 2014: Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource, Inc. is featured in the publication titled “Microwave and Millimeter‐Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.

Microwave and Millimeter-Wave Electronic Packaging -bookAuthor, Rick Sturdivant, has over 20 years of industry experience in designing modules, packages, and integrated circuits for microwave and millimeter‐wave applications. Sturdivant earned his M.S. in electrical engineering at UCLA and he currently works as a consultant and in business development. Sturdivant can be contacted at http://www.ricksturdivant.com and his book can be purchased through Artech House.

Casper explains that “when Sturdivant approached UltraSource for examples and photos that would be applicable to his new book, we were thrilled to have the opportunity to contribute photos of our thin film ceramic devices and product examples for him to use as reference in his publication.”

Casper commented that “Sturdivant’s book is well written and laid out in an easy to understand manner and contains relevant information for electrical engineers designing today’s cutting edge technology. Chapter 3 –expertly explains ceramic packaging advantages for microwave and millimeter‐wave applications. UltraSource, Inc. specializes in fabricating custom thin film circuits and interconnects on ceramics in order to deliver those advantages to our customers”.

Casper, on behalf of UltraSource, Inc., would like to congratulate Rick on his publication and wish him success with his book.

To discuss your specific design and application needs, contact UltraSource at www.UltraSource.com or (800) 742‐9410.

About UltraSource

Founded in 1991, UltraSource, Inc. (USI) is one of the world’s largest thin film suppliers offering leading edge quick turn, custom, and volume production services of complex microcircuits for technically demanding high density analog, mixed-signal, digital, power, hybrid circuit, RF, microwave and millimeter wave applications. Electronics system design is placing increasing emphasis on high frequency performance and reduced package size; UltraSource products and services deliver thin film microcircuit solutions that enable customers to advance towards evolutionary bandwidth performance, integration, and quality. UltraSource solutions include:

volume thin film products, advanced high density thin film multilayer interconnects and circuits customized for aerospace/defense, homeland security, electronic medical devices applications, piezoelectric actuators, I/R imaging, sensor, hermetic seal metallization, resistive heaters for optical lenses, telecommunications infrastructure, fiber optics, broadband networking, test and measurement, and many other specialty electronic applications. UltraSource, Inc. is headquartered in Hollis, NH, USA. Additional information is available at www.ultrasource.com.

Contact:

Corporate Communications Manager

Dawn Hallett

603‐881‐7799

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Published in:

RF Globalnet.com
Semiconductor Packaging News