UltraSource, Inc. Announces PolyVia – A Reduced Cost Plugged Via

HOLLIS, NH, June 18, 2014: UltraSource, Inc. (USI) announced today that it has developed a reduced cost plugged via option called PolyVia. PolyVia was recently showcased at the IEEE-IMS, Tampa Bay, on June 3-5. The PolyVia product is a polyimide-based plugged via option that customers can add to their plated-through hole designs in order to stop epoxy or solder bleed-thru during assembly operations.

Michael Casper, President & CEO of UltraSource, said “our customers are always looking for new ways to reduce costs and increase performance, especially for their lower cost commercial products. We spent the last six months developing a low cost but highly reliable polyimide plugged via. We are confident that the PolyVia will allow our customers to be more competitive by eliminating rework at assembly operations – avoiding the need for a more costly metal filled via system.”

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UltraSource to present thin film circuit design solutions at IMS 2013

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year's IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6.

UltraSource will be located at Booth #611 and be on hand to speak about a wide range of their product and technology offerings from their extensive portfolio: CopperVia, UltraFast, Polyimide Options, Back-Side Burnishing, and Ultra-Thin substrates.

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